Laser cutting is to irradiate the cut material with a high power density laser beam laserpecker 2 pro, so that the material is quickly heated to the vaporization temperature and vaporized to form holes. With the movement of the light beam on the material, the holes are continuously formed into slits with a very narrow width (such as about 0.1 mm), thus completing the cutting of the material. Laser cutting is one of the thermal cutting methods.

With the rapid upgrading of laser equipment, laser cutter the laser industry at home and abroad has ushered in a period of rapid development, and nanosecond, picosecond and femtosecond have gradually become market hotspots. Widely used in sheet metal processing, aviation, aerospace, electronics, electrical appliances, underground accessories, automobiles, food machinery, textile machinery, construction machinery, precision accessories, ships, metallurgical equipment, elevators, household appliances, craft gifts, tool processing, decoration, advertising, metal external processing, kitchen utensils processing and other manufacturing and processing industries.

So, what is the difference between nanosecond, picosecond and femtosecond laser cutting laserpecker 1? Power Star Laser Technical Engineer will answer your questions.

Laser cutting machine

Laser cutting nanosecond, picosecond, femtosecond analysis:

1. The difference between the concepts of nanosecond, picosecond and femtosecond laser cutting:

The nanosecond, picosecond and femtosecond in the laser processing equipment are the time control units of the laser processing process, drilling, cutting, marking, welding and other applications are formed by high frequency repeated work.

At the same time, it should be understood that 1 second = 109 nanoseconds = 1012 picoseconds = 1015 femtoseconds, so the common nanosecond, picosecond and femtosecond laser processing equipment on the market is named after time, and there are many factors such as the energy, pulse width, pulse frequency and pulse peak power of a single pulse. According to the processing needs of different materials, the corresponding nanosecond, picosecond and femtosecond laser processing equipment should be selected. The shorter the time, the greater the effect of laser on materials. The shorter the time, the shorter the time for laser to act on the material surface, the smaller the effect on the material surface, and the better the processing effect.

Laser cutting nanosecond, picosecond, femtosecond difference processing materials:

Under different processing conditions, the choice of time unit is different, so there will be naming rules for nanosecond, picosecond and femtosecond laser equipment. Such as nanosecond ultraviolet laser cutting machine commonly used for thin film material processing, picosecond ultraviolet laser cutting machine commonly used for brittle material processing, femtosecond ultraviolet laser cutting machine used for conductive film oxidation and other materials processing. (UV is named according to the rule of wavelength, for 355nm laser).

Laser cutting nanosecond, picosecond, femtosecond processing application differences:

Laser drilling is one of the common applications of picosecond laser. Picosecond laser can complete the hole processing by impact drilling and ensure the uniformity of the hole. In addition to circuit boards, picosecond lasers can also drill high-quality holes in plastic films, semiconductors, metal films, sapphires and other materials.

Line ablation is one of the micromachining applications of picosecond lasers, in which the coating is precisely removed with no or only slight damage to the substrate material. The ablation can be a line a few microns wide or a large area a few centimeters square. Because the thickness of the coating is usually much less than the width of the ablation, heat can not be transmitted laterally. A laser with a nanosecond pulse width can therefore be used.

Precision laser cutting is one of the common applications of femtosecond laser, which can be used to cut various substrates.